Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
filingDate |
2013-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcaed5d2c0026606f452bdd97025be84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd6c171f54af1de5467932c43b2f320c |
publicationDate |
2018-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I609920-B |
titleOfInvention |
Curable composition for optical semiconductor sealing and optical semiconductor device using the same |
abstract |
An object of the present invention is to provide a curable composition for optical semiconductor sealing that obtains a cured product having excellent impact resistance and adhesion, and a cured optical semiconductor element obtained by curing the curable composition for optical semiconductor sealing. Light semiconductor device.nn n n The curable composition for sealing an optical semiconductor of the present invention is characterized by containing (A) a linear polyfluoro compound, (B) a fluorine-containing organohydrosiloxane having a SiH group and a fluorine-containing organic group, and (C) a platinum group Metal catalyst, (D) Cyclic organosiloxane containing SiH group, fluorinated organic group and epoxy group, and hardened product obtained by hardening. A type durometer (Durometer) specified by JIS K6253-3 The hardness is 30 ~ 80. |
priorityDate |
2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |