http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I600701-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4283a2f8ade5dc582d75300427a38e50
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2190-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
filingDate 2013-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfbf51631843a336a148465ef3202d96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_868bd22632ca2b8c244dc068cff028f7
publicationDate 2017-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I600701-B
titleOfInvention A semiconductor sealing epoxy resin composition and a method of manufacturing the semiconductor device
priorityDate 2012-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419540653
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414881222
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID417295882
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420288481
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426053676
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID151055599
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16993
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID71343643
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID417471591
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453380850
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID416037284
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID608116
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4987597
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID150907718
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID85689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19806430

Total number of triples: 51.