| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b39b5e20e9d581a0dc8e0b4c790e9bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2016-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd3aba2e4ce43e196e6d59d76149bb8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f459f808446587eab1d6ae2c126d1990
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3764693684be30524691ae3ddb4aa500
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77bd88be55e803b3466108527705c699
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b3b915a3aaf36edaa837482f8d8a275 |
| publicationDate |
2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I595024-B |
| titleOfInvention |
Polylysine, copper clad laminate and circuit board |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I646150-B |
| priorityDate |
2016-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |