| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9849fc45c83161cdb5e3c8ff79ef0e4e |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L65-00 |
| filingDate |
2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_515fe595a4117d7f00c3d4721e641279
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9dcbe9eb6ae8e818f439afb48039325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87d055947b6e498a95e59cbd24a5725b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_774be35aded335f35ba431d9e480efb8 |
| publicationDate |
2017-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I577732-B |
| titleOfInvention |
A low dielectric resin composition, a semi-cured film to which the copper foil substrate is used, and a copper foil substrate Circuit board |
| priorityDate |
2013-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |