| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_476660a2bdbd088c6efffa3162df458b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03009 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-428
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-428
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate |
2015-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c55b4111b3b62297e5f5637c4bd47b3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9551c679129a353c2e89e68955d1f925
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8150c1d62dc248e863077af4dd33f79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3d51ed80a355237b3947259f5841fc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff13aada94ccd94c3aa42f98e5fd8e46 |
| publicationDate |
2017-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I569371-B |
| titleOfInvention |
Method for protecting installation tape during laser single-cut wafer process |
| priorityDate |
2014-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |