| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79977b1af9b2241bb6386e9d893a9d89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217fd2dbe27cf853d70732db5a5696d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba88f45ed8b516b71dd73178bd131895 |
| publicationDate |
2016-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I557271-B |
| titleOfInvention |
Formaldehyde-free electroless copper plating solution, use thereof and method of electroless copper plating |
| priorityDate |
2011-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |