Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0530c14c7a5b9a232bb9e17ec7fa5d16 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K23-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
filingDate |
2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af570e1ec928b1733ed3e280af5e4dd2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36010f586f6a4004194e48a06c57018c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14a3fd8da574c397835ac924757fde6f |
publicationDate |
2016-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I546121-B |
titleOfInvention |
Copper microparticle dispersion and method for forming conductive film |
priorityDate |
2011-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |