Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate |
2009-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16d95b96439a6026d232a295bb221845 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe |
publicationDate |
2016-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I541281-B |
titleOfInvention |
A thermosetting resin composition, a hardened product thereof, and a printed circuit board using the same |
priorityDate |
2008-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |