| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13083 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d50b47e75dcd954f0fceb57e85af4162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed42f66f640a347604ad9b4961a2730f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bd81180ebc4fdb7c2ae1310e07fc4c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_606d3c3edb4ca8845857f838dba781a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c5d01be6b471909fc7c74f781b3c00a |
| publicationDate |
2016-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I529882-B |
| titleOfInvention |
Interconnect structure of package components and bumps on wires |
| priorityDate |
2012-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |