Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6e8683cde95e36ce68d18801b59bfbd4 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68771 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate |
2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4337f706e1beb017cf3404b087acc67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_279fedc5092bb682031f3e89c55b83f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a25bc2855c84ba9606272ffb637c2c0d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c021b46528ed30efd8dd1b89ae27db2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4984e516ae05f79436f939e29903b27e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b98d61e38a4b9ae3fccc5404ac4a817f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6cafbf60ee8145769e6248f112605aa |
publicationDate |
2016-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I527108-B |
titleOfInvention |
Method and apparatus for plasma cutting semiconductor wafers into small pieces |
priorityDate |
2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |