Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7886f9841c03e2449d28f454ebbe1dc |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-26 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-30 |
filingDate |
2006-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff6c7bacc07eab4cac92aa54f91cd8c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3d91e00e9a811465af889d2c91aad5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25ddb2110235926cd7292ef07e48a0c1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb9b49f34b9a3df554bf1a76dba1323f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1f48afa15522e4a50d7868cb7d6e7c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3989dc9750463ee8001672175c6d719 |
publicationDate |
2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I507521-B |
titleOfInvention |
Chemical mechanical polishing polishing composition after copper passivation and method for using the same |
priorityDate |
2005-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |