patent/TW-I505416-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I505416-B

Outgoing Links

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filingDate	2010-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8522372c04385cde8d28b37eff4e144e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6bc085edf716bfcae636c60e2d8a91b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3253ce6a87d9043c1ad5f98c66951607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1c038d86ecdd533ee2e43aac2a87c03
publicationDate	2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-I505416-B
titleOfInvention	Adhesive tape for resin sealing and manufacturing method of resin-sealed type semiconductor device using the same
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I749111-B
priorityDate	2009-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 64.