| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5e4c48663fb899e6ce58f22de5af1d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 |
| filingDate |
2009-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27a66d93180ef6de6bd9b308608fe049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e746d274b62a9d0e521e14c344d9bc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7256cefd9f174c7108ac3aa6975d97eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00d412e05ba9b4d2e4610a52b23bc393 |
| publicationDate |
2015-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I471455-B |
| titleOfInvention |
Electroless plating solution, electroless plating method using the same, and method for manufacturing wiring board |
| priorityDate |
2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |