http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I464305-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_442006254efb98c9cebec6ee5a08d5e8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-34 |
| filingDate | 2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f30f1fc8079cb98217d03a89917e20f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb6d23cb6cca6744fe4e369afa780934 |
| publicationDate | 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I464305-B |
| titleOfInvention | (TSV) electroplated copper filler inhibitor and electroplating copper filling formula |
| priorityDate | 2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.