patent/TW-I456717-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I456717-B

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
filingDate	2011-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2014-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf4c79a8f03e35df0ba1acfe7e1a728f
publicationDate	2014-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-I456717-B
titleOfInvention	Microelectronic package with dual or multiple etched flip chip connectors
priorityDate	2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008003402-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009146303-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 76.