| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_295109133d3eb97361607c70f2210fe7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2012-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a94e9262a0cd5c81982090a9e761c81f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94feec430115aba0c2ec6fc4724a5968
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dd5f8034873de3aa7006541edc33a01 |
| publicationDate |
2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I455665-B |
| titleOfInvention |
Flip-chip LED package module and its preparation method |
| priorityDate |
2012-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |