| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7442b6cce4e96d3dc4a380851e9224d8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2009-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32d76ab320bda9a2aba7093cb23ecb7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f91c294dede7f1de9e3cc125e14820b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d02ad4910e15a94c4262dff734bef1ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8684d6d5575ddb7181d52f68a60b71ed |
| publicationDate |
2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I454597-B |
| titleOfInvention |
Method for electrodepositing copper in a microelectronic device using a bipyridyl-based leveling agent |
| priorityDate |
2008-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |