| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_18a2872179e7a7aff6718445d1842c22 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2009-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21c92958f832b11780f0f2efe13e1ab3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ab46ffc3de021ca47dea35770fb099b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b9b811b4b11ff361ac2aca1dcee7e2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda8478e729cf096cd78df88b27d6d04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d75dcfffee479383778fdbafa99b6e1 |
| publicationDate |
2014-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I445810-B |
| titleOfInvention |
Method for preparing a chemical mechanical polishing slurry, a method for removing a copper layer from a substrate, and a highly dilutable polishing concentrate |
| priorityDate |
2009-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |