| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2009-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b85a2dd260d48facdef58fb581dee30e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2800f6df55d564d0a58097320317c406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8359c4c853057b99bce5c037942e42d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2ad1c3ad155342e38849d635d60ffc7 |
| publicationDate |
2014-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I437133-B |
| titleOfInvention |
Aqueous acid bath and method for electrolytic deposition of copper |
| priorityDate |
2008-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |