| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32c182780ae8fd1eabf081eb5ef98479
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c46d81ab984795467b04f02b0e46d48e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31855 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2008-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75cc9684fafaa00e06051d4a21eb27ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eac1a24c27d00b8308cbaa85cc3f16a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02fac37e00008e7b162f44de4ea0b1d7 |
| publicationDate |
2013-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I415970-B |
| titleOfInvention |
Electroless plating forming material, coating solution for catalyst attachment, electroless plating forming method, and plating method |
| abstract |
A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps. |
| priorityDate |
2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |