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filingDate 2011-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2013-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I414092-B
titleOfInvention Light-emitting diode package structure and manufacturing method thereof
abstract An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allytrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.
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