| abstract |
A free-standing III-N wafer, wherein III denotes at least one element of the group III of the periodic Table of Elements, selected from Al, Ga and In, is obtained by a process comprising providing a III-N layer having a surface, which comprises more than one facet, and selectively depositing a mask material only on one or multiple, but not on all facets during a III-N layer growth process. Thereby, it is possible to produce free-standing thick III-N layers. Further, semiconductor devices or components having special structures and layers can be produced. |