| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L21-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4632
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 |
| filingDate |
2006-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bda01b5f2f9c048683a900cb34ede4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da |
| publicationDate |
2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I410442-B |
| titleOfInvention |
A resin composition for an insulating layer of a multilayer printed circuit board |
| abstract |
Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board. |
| priorityDate |
2005-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |