http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I405793-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4572f6f6139a1ecea4a501623432ecf2 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D7-01 |
| filingDate | 2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_112ee886d7c410bf0eddfd9396697c40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f93e4bd7f28ad773ea57d08ea59a5f3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2af7a33c7120b11f1b6f428ba8a24efe |
| publicationDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I405793-B |
| titleOfInvention | Wafer-mounted (CHIP-ON) film |
| abstract | A chip on film is provided to enhance the flexibility of the film by using a polyimide film having high dimension stability and desired elastic modulus. A chip on film includes a polyimide film(1) and a wiring(2) formed on at least one surface of the polyimide film, on which an integrated chip is mounted. The polyimide film includes para-phenylenediamine and 4,4'-diamino diphenyl ether as a diamine component, and pyromellitic dianhydride and 3,3',4,4'-biphenylyl tetra carboxylate dianhydride as an acid dianhydride component. The wiring is formed on the polyimide film with no adhesive. |
| priorityDate | 2005-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.