| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6875
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00 |
| filingDate |
2005-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff7a9827027deae680d3a0a47bd8f300 |
| publicationDate |
2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I404163-B |
| titleOfInvention |
Thermal conduction system for improved semiconductor processing uniformity, plasma processing system for processing a substrate, and method for processing a substrate in a processing chamber |
| abstract |
A plasma processing system and methods for processing a substrate using a heat transfer system are provided. The heat transfer system, which is capable of producing a high degree of processing uniformity across the surface of a substrate, comprises a uniformity pedestal supported on and in good thermal contact with a heat transfer member. The uniformity pedestal includes a pin array which provides a conformal substrate support surface (i.e., contact surface) that can conform to the profile of a backside surface of a substrate during processing. To uniformly cool a substrate, a large thermal gradient can be established between the uniformity pedestal and the heat transfer member during the processing of a substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I757242-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I733095-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11158527-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I732190-B |
| priorityDate |
2004-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |