| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f9af914ed2fb00cd4f1b8b1a28964e4 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1466
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 |
| filingDate |
2008-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76d13d465af383f0cfe65dfa0f7ec8fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d077e73631a88cf3500b345faf4eb40d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_182c9879a7f0a2f556ee8028df698e9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38f0c2e92e8958c973a7bf989e073775 |
| publicationDate |
2013-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I399393-B |
| titleOfInvention |
Solder resist dry film and hardened materials and printed circuit boards |
| priorityDate |
2007-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |