| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07b154a27762722c85876e08c2ac4268 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate |
2009-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d5eb020d23204a5cf30a4556f078ec1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca1b42ce9072302e2e49f1277e55b106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23ad287652ccf2e74ad9f61514289d88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d8419f2272882e79d54bd3695456caf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff746f2f4f16b3abebc3346bb64d1461 |
| publicationDate |
2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I381462-B |
| titleOfInvention |
Direct die assembly using heated bond heads |
| priorityDate |
2008-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |