Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203 |
filingDate |
2005-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2012-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2de109cc58448f0690a01edbb31a1d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d2825c5d72be8595d43a103093ec8b5 |
publicationDate |
2012-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I362116-B |
titleOfInvention |
Resin sheet for sealing semiconductor and manufacturing method of semiconductor drvice using the same |
abstract |
Problems To provide a semiconductor sealing resin sheet with which no void is formed in sealing a flip-chip bonded device and wires are not deformed or broken in sealing a wire-bonded device, and a method for manufacturing semiconductor devices using the resin sheet. Means for solving the problems The semiconductor sealing resin sheet relating to the present invention is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermosetting is 1.0x10 3 to 1.0x10 4 Pa, the melt viscosity 120°C of the sealing resin layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the sealing resin layer before thermosetting is kept at a constant temperature of 120°C. |
priorityDate |
2004-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |