http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I323207-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-0009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D18-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20 |
| filingDate | 2004-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_099cf4b00962d5d96e751f53dc918f62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56001f6a1048383fd633d33d2ecd3cc3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c5d56c6c033d9fd7b104c7056105aba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a50587834fb2591d295e576d00a4e224 |
| publicationDate | 2010-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I323207-B |
| titleOfInvention | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
| abstract | An abrasive pad (1) capable of transmitting light for end point detection without reducing polishing efficiency in the polishing of a semiconductor wafer using an optical end-point detection device, method of manufacturing the abrasive pad, a metal mold (7) for manufacturing the abrasive pad, and a method of polishing a semiconductor wafer. <??>This abrasive pad (1) comprises an abrasive substrate (11) and a light transmitting member (12). The light transmitting member (12) comprises a crosslinked polymer such as crosslinked 1,2-polybutadiene and a water-soluble substance such as beta -cyclodextrin dispersed in the crosslinked polymer. Since the light transmitting member (12) and the abrasive substrate (11) are fused together as an integrated unit, slurry does not leak to the rear side of the abrasive pad during the abrasive pad used. This manufacturing method comprises setting the light transmitting member (12) in the metal mold (7) for insert molding and crosslinking a matrix dispersion for forming the abrasive substrate in this mold. The polishing method using this abrasive pad employs an optical end-point detection device. <IMAGE> |
| priorityDate | 2003-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.