Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3079157bddd39be3e0ad51db39243cfe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b51e30378bb17ea6392f81495306b86d |
publicationDate |
2010-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I322471-B |
titleOfInvention |
A semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method |
priorityDate |
2004-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |