http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I304239-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cb04eda027b1b2cc5629963de49fd068 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2004-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf9daed034142f22bc88f1df4bf28d7 |
| publicationDate | 2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I304239-B |
| titleOfInvention | Semiconductor chip, chip package and chip package process |
| priorityDate | 2004-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.