| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y99-00 |
| filingDate |
2006-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89cbc2c0c9bb9971895233d17ad59054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dee13d2eb2f27c31851606f1d4db73f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31c67ada633b7d4707e1a81572039a6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8124b588eb02a91e00dfe4f46802f1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4847eb532b682970af32cdcd3672c828 |
| publicationDate |
2008-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I303272-B |
| titleOfInvention |
Cmp slurry for metallic film, polishing method and method of manufacturing semiconductor device |
| priorityDate |
2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |