| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate |
2005-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f7c38195aec5ddb25a7a6f0b07dc455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6bca20dc88e9acbdb685bf6b3f5c7c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27c6493ed9f77b2406c32680d5a28fec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9229c43fb36fbc71481adaca82573ded
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db679d880fa59cc11703bac906063729 |
| publicationDate |
2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I297696-B |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| priorityDate |
2004-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |