| abstract |
The present invention provides a surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications. <??>The surface treated copper foil of the present invention comprises a copper foil provided a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided to the S side and/or the M side thereof. The copper foil of the present invention has adequate adhesive strength even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer. |