Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2005-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2008-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad2471182fbe7d11a9b247c32093c1de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3560365e318769b1a6d51dca8c67d2b2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a881d962a0249bfc5cccdf38949a65e9 |
publicationDate |
2008-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I296432-B |
titleOfInvention |
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects |
priorityDate |
2004-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |