| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07b154a27762722c85876e08c2ac4268 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate |
2005-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_655b0b316495502482745164dd9a558e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fff7c9990ae5cd7a0c7cbfa0e88a9b91
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0488c273e30e1c06062cc2e06aee17d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a32c2cd86662da25dfd339976d791b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa85b900c66fc9342e32ce100bc225d7 |
| publicationDate |
2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I295091-B |
| titleOfInvention |
Coating for enhancing adhesion of molding compound to semiconductor devices |
| abstract |
A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution. |
| priorityDate |
2004-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |