| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3895dc80ced9468f9f7a7e4244f241e3 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2006-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af5d685252a340dc51f2cc5eb68c9f8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4c4766a414e58561be765449917f767 |
| publicationDate |
2008-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I292295-B |
| titleOfInvention |
Method for monitoring the filling performance of copper plating formular |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I455667-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103698372-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103698372-A |
| priorityDate |
2006-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |