| abstract |
A substrate treating device and a substrate treating method are presented. The substrate is treated by and electrolytic processing method which minimizes the work load on the CMP process, for example, planarizes the conductive material provided on the surface of the substrate, and removes debris adhered to the surface of the substrate. The substrate treating device includes a load and unload unit (30), an electrolytic processing unit (36), which has a power supplying member (373) to contact the surface of the substrate W having a film formed thereon to be processed, for electrolytically processing the surface of the substrate W, a bevel etching unit (48) for removing by etching the film on the surface substrate W to be processed, the film to be processed being left on the part in contact with the power supply member (373) of the electrolytic processing unit (36). The device further includes a chemical mechanical polishing unit (34) for polishing the surface of the substrate W from which the film to be processed has been removed by etching, and a transfer robot (32) for transferring the substrate within the substrate treating device. |