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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-04
filingDate 2001-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c632cdffe9e9d26c30ae58b8b8c0be7
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publicationDate 2007-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I288157-B
titleOfInvention Resin composition with low dielectric constant and its use
abstract A resin composition with a low dielectric constant comprises: (a) 5 to 99.99 parts by weight of a functionalized styrene copolymer; (b) 0.01 to 95 parts by weight of a mixture of epoxy resins; and (c) 0.1 to 60 parts by weight of a curing agent. A substrate made of the resin composition and a hybrid substrate made of the resin composition and engineering plastic sheets exhibit reduced dielectric constants of 3.4 and 2.4 at 1 GHz, respectively.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102295742-A
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