| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V19-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2005-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_100f14675d011809766adc6aa8b575f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ed1101e517de52e2c85d458a66f0999
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86fa12423988d7548a3adca016682521
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82f9ea6f202cb105911fe31a93fc069d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff59fb29a904adcee8eb1e3a822272b4 |
| publicationDate |
2007-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I287837-B |
| titleOfInvention |
Film for protecting semiconductor wafer surface and protection method of semiconductor wafer by using the same |
| abstract |
A film for protecting semiconductor wafer surface and a protection method by using the same are provided, wherein the broken semiconductor wafer can be prevented even when the semiconductor wafer is thinned out to no larger than 200 mum. The adhesive film for protecting semiconductor wafer surface of this invention is an adhesive agent layer which is formed on a single surface of a substrate film, wherein the substrate film includes a layer (A) with storage elastic modulus of 1x10<7> Pa to 1x10<9> Pa at 20 DEG C to 180 DEG C. |
| priorityDate |
2004-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |