| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b637f9f45afd69585579aa44456b785c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-5024 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2005-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9be7ed327e6a5afcc07c0ca6b0ab2e97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ae2bf457b893a46de9794afe932bfa6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98faf96a633827a939c8b1420313da8a |
| publicationDate |
2007-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I287482-B |
| titleOfInvention |
Polyurethane urea polishing pad |
| abstract |
The present invention relates to an article for altering a surface of a workpiece, or a polishing pad. In particular, the polishing pad includes a polyurethane urea material wherein at least a portion of the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. |
| priorityDate |
2004-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |