| abstract |
A semiconductor package without chip carrier includes an insulating structure having an opening; a die pad layer provided in the opening; a chip adhered to the die pad layer by a thermally conductive adhesive; a plurality of electrical contacts provided around the die pad layer, wherein at least one of the electrical contacts is provided on a top surface of the insulating structure; a plurality of electrical connection members for electrically connecting the chip to the electrical contacts; and an encapsulant for encapsulating the chip, the insulating structure, the electrical connection members and the electrical contacts, wherein a bottom surface of the insulating structure, a bottom surface of the die pad layer, and bottom surfaces of the electrical contacts except the least one electrical contact provided on the top surface of the insulating structure are exposed from the encapsulant and are flush with a bottom surface of the encapsulant. The present invention also provides a fabrication method of the semiconductor package. |