http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I283757-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81bbed339049c84138a09736b647d40e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2004-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae79a7164252672b8279d1de22572f8 |
| publicationDate | 2007-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I283757-B |
| titleOfInvention | Early reliability testing method for circuit substrate |
| abstract | The present invention discloses a method for testing reliability of circuit substrate at an early stage. The method comprises providing a circuit substrate including a substrate and a dielectric layer with an electric circuit thereon and filling in a blind hole of the dielectric layer; peeling the dielectric layer to expose a conductive stud in the blind hole; and pushing the conductive stud to fall down using a shear force, thereby obtaining a shear strength between the conductive stud and underlying member. |
| priorityDate | 2004-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.