| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04 |
| filingDate |
2005-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8337eca3c50c8d45b66cd1cd7d9adbf8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_077552f5303766f4c65340dab8ac58ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_344989c36d3bf6795cc5b97132d13eaf |
| publicationDate |
2007-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I282801-B |
| titleOfInvention |
Slurry for polishing use |
| abstract |
This invention discloses a slurry for polishing use. The slurry for polishing use can planarize the copper surface without damaging it in the process of making the copper wiring during the semiconductor device manufacturing process. The slurry for polishing use of this invention is characterized in that it contains an organic particle (A) in a part of the surface of organic particle (B), that has the functional group that can react with the polished metal and is coated with resin (C), that doesn't contain the functional group that can react with the polished metal. |
| priorityDate |
2004-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |