http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I282585-B
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af2a54ef138604c5b43bc962f5efd4bf |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06738 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2648 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
filingDate | 2003-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2007-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_266ea6a3851cb569a83a976a1ba82a3d |
publicationDate | 2007-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-I282585-B |
titleOfInvention | Apparatus and method for determining doping concentration of a semiconductor wafer |
abstract | An apparatus for measuring at least one electrical property of a semiconductor wafer includes a probe including a shaft having at a distal end thereof a conductive tip for electrically communicating with an object area of the semiconductor wafer. The apparatus further includes a device for applying an electrical stimulus between the conductive tip and the object area, and a device for measuring a response of the semiconductor wafer to the electrical stimulus and for determining from the response the at least one electrical property of the object area of the semiconductor wafer. A probe guard is included and surrounds the shaft of the probe adjacent the distal end of the probe. The probe guard also insulates the conductive tip from the semiconductor wafer. |
priorityDate | 2002-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
---|---|
isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419578752 |
Total number of triples: 21.