http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I282156-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2003-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_801f891e08ab71b19141a5a4a49d17e5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9cb822d20d7534e8b940f83da115073 |
| publicationDate | 2007-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I282156-B |
| titleOfInvention | Heat conductive sheet with magnetic wave absorption |
| abstract | The present invention provides a kind of heat conductive sheet having magnetic wave absorption. In the invention, the electrically insulating electromagnetic wave absorbing heat conductive sheet is formed by laminating at least one electromagnetic wave absorbing layer in which soft metal powder is dispersed in a base polymer, and at least one electrically insulating heat conductive layer in which an electrically insulating heat conductive filler is dispersed in the base polymer. The sheet has a dielectric breakdown voltage larger than 1 kV in the direction of the sheet thickness. Because the invented electromagnetic wave absorbing heat conductive sheet is provided with high electromagnetic wave absorbing characteristic, high heat conduction characteristic and electric insulation, it can be fitted to an optimum place without consideration of an electrical short circuit of each component such as printed wiring board when mounted inside the electronic machine. Therefore, it can suppress electromagnetic wave noise in an electronic apparatus and the increased electromagnetic wave leakage amount radiated toward outside of the apparatus. In addition, it can radiate heat generated from components in the electronic apparatus to the outside of the apparatus. |
| priorityDate | 2002-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.