http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I282041-B

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filingDate 2004-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I282041-B
titleOfInvention Method for fabricating microlens with lithographic process
abstract A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlens.
priorityDate 2003-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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