| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56c108700ba88e7089f8a35b0d506000
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7232f48d5f42e61cbc2cc3b53d31499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9462533ba2d39b578178049a49711d6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac22ebb5435a509ed151568b90582f36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebd2813fa0b8c734a92d389ad58cf93c |
| publicationDate |
2007-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I281211-B |
| titleOfInvention |
Methods for electrochemical deposition (ECD) and for fabrication integrated circuit devices on a semiconductor substrate with damascene structures and defect-free ECD metal layer on the semiconductor wafer |
| abstract |
A method for filling a structure using electrochemical deposition includes a barrier layer and a seed layer being deposited on one or more surfaces of the structure. Metal is electrochemically deposited to fill the structure in an electrochemical plating cell, wherein the electroplating surface of the substrate is tilled and rotated during electrochemical deposition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I383071-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I410531-B |
| priorityDate |
2005-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |