| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81bbed339049c84138a09736b647d40e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_427c0818e7de99fb0b736e9472a4eb6b |
| publicationDate |
2007-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I280647-B |
| titleOfInvention |
Stacked structure of thin small outline package (TSOP) |
| abstract |
A stacked structure of TSOP is provided. In the package process of the present invention, all dies are stacked orderly in the same direction, preventing the displacement or short circuit occurring in the metal wires when half of dies must be stacked in the opposite direction and the leaf is reversing. |
| priorityDate |
2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |