| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f71ddd387b22b19ebcea454e62d66128 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
| filingDate |
2004-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e23c51f3a12eac67cccf2b4c3c16ab70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80190629b45a2ebe1d775523dfb411af |
| publicationDate |
2007-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I276491-B |
| titleOfInvention |
Solder paste |
| abstract |
A solder paste, wherein a flux and a solder powder is mixed and the flux comprises a solvent exhibiting a property that, in the measurement according to the TG method, a temperature at which the percentage loss of weight is 15 mass% is higher than the melting peak temperature by 5 DEG C or more. The solder paste can be used for suppressing the generation of voids and preventing the generation of a void having a large diameter adversely affecting the reliability of the connection by soldering. |
| priorityDate |
2003-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |